Analysis of Hyoid Structured And Perforated Pinfin Heat Sink In Inline And Staggered Flow
Journal Title: International Journal of Science Engineering and Advance Technology - Year 2014, Vol 2, Issue 4
Abstract
The usage of the electronic goods has been increased tremendously; hence it is the challenging task to improve the cooling for such devices. The heat dissipation rate should be maximized in the electronic devices like integrated CPUs, chipset and hard disk drives with the help of heat sinks, fans and other forms like liquid cooling in order to protect the device due to overheating,as overheating results in reducing the life or damaging the device, hence it is necessary to modify the heat sink design in various vital parameters like fin height, fin length, fin thickness, number of fins, number of perforations, base plate thickness, fin spacing, material etc. The main objective of this present paper is to present the modified model of the heat sink with above mentioned geometrical parameters, and both flow types of inline and staggered with and without perforations of C/H=0, C/H=0.333, and C/H=1; =1.308, 500 < Re < 42,000; 1.208 < Sy/D < 3.417, 0 < C/H < 1 and observing the heat flow rate in the Hyoid (U-shaped) pin fin heat sink. The results revealed improved heat dissipation characteristics.
Authors and Affiliations
T. Therisa| M.Tech Scholar, Dept. of Mechanical Engineering, B.V.C. Engineering College, Odalarevu, B. Srinivas| Professor, Dept. of Mechanical Engineering, B.V.C. Engineering College, Odalarevu, A. Ramakrishna| Professor& HOD, Dept. of Mechanical Engineering, B.V.C. Engineering College, Odalarevu
Keywords
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