ANALYSIS OF TWO KINDS OF INJECTION MOLDS FOR MOBILE PHONE BACK COVER BASED ON MOLDFLOW
Journal Title: Topics in Intelligent Computing and Industry Design (ICID) - Year 2017, Vol 1, Issue 2
Abstract
Firstly, application of Moldflow on the mobile phone cover with two different injection methods which one is to use pin-point gate and the other is to use latent gate to simulate the injection molding process, then we analyze the results from the filling time, air traps, weld lines and the warpage four aspects. Lastly, we find out the effect of latent gate is better than that of pin-point gate by compare the above four results.
Authors and Affiliations
Sun Bao-fu, Jiang Cong, Hu Ming-jiang
Keywords
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- EP ID EP409497
- DOI 10.26480/wsmce.01.2017.34.36
- Views 44
- Downloads 0
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