"Bridging of spine” – titanium alloy and polymer PEEK for intervertebral stabilization of spine
Journal Title: Engineering of Biomaterials / Inżynieria Biomateriałów - Year 2015, Vol 18, Issue 133
Abstract
In spinal implantology there are two types of implants: “non-fusion” and “fusion”, that is without and with bone overgrowth, respectively. A larger group consists of stabilization with bone overgrowth, for which speed and quality of osseointegration is crucial for final treatment outcome. The most commonly used biomaterials are titanium alloys and polietero-eteroketon (PEEK) of different 2D surface topography and 3D spatial structure resulting from the finishing, surface layers or production methods. It has been shown that osseointegration depends largely on suitable configuration of 2D and 3D, topography, porosity and surface energy. The impact of biomaterial type: Ti6Al4V titanium alloy ELI, PEEK OPTIMA and implant production technology: deficient (PEEK, Ti), incremental EBT-Electron Beam Technology (Ti-3D-Truss) on the osseointegration were analyzed. In compliance with corresponding process conditions of implant production, models/samples were prepared and subjected to in vitro biological tests and in vivo animal tests. Collected animal specimens with implants models were tested for osseointegration with the use of CTt tomography. The results confirmed the biocompatibility of tested biomaterials, and thus safety in the bone surgery. Ti6Al4V ELI alloys compared with PEEK polymer are favourable biomaterials for “fusion” interbody stabilization. The polymer PEEK Optima is preferred material for “non-fusion” stabilizations. The use of EBT technology for implant production made of Ti6Al4V ELI powder allows to obtain “volcanic” surfaces and spatial/lattice Ti-3D-Truss structures with a large surface area which accelerate the bone over-/in-growth through the implant. Previous reports indicate improved clinical effectiveness of surgical treatment involving the accelerated bone overgrowth in the “bridging” of spine with the use of Ti-3D-Truss interbody implants.
Authors and Affiliations
L. F. Ciupik, A. Kierzkowska, J. Sterna, M. Cieślik-Górna
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