Mechanical performances of lead-free solder joint connections with applications in the aerospace domain
Journal Title: INCAS BULLETIN - Year 2016, Vol 8, Issue 1
Abstract
The paper presents some theoretical and experimental aspects regarding the tribological performances of lead-free solder joint connections, with application in the aerospace domain. In order to highlight the mechanical and tribological properties of solder joint in correlation with different pad finishes, there were made some mechanical determinations using a dedicated Share Test System. The theoretical model highlights the link between the experimental results and the influence of gravitational acceleration on the mechanical and functional integrity of the electronic assemblies that works in vibration environment. The paper novelty is provided by the interdisciplinary experiment that offers results that can be used in the mechanical, tribological, electronical and aerospace domains.
Authors and Affiliations
Georgiana PADURARU, Andrei TUDOR, Alina PETRESCU, Ioan PLOTOG
Keywords
Related Articles
- EP ID EP143695
- DOI 10.13111/2066-8201.2016.8.1.12
- Views 65
- Downloads 0
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