APPLICATION OF ELECTRONIC SPECKLE PATTERN INTERFEROMETRY TO MEASURE THERMAL STRAINS OF THIN LAYERED STRUCTURES Journal title: ROMANIAN JOURNAL OF TECHNICAL SCIENCES - APPLIED MECHANICS Authors: MIRCEA CRISTIAN DUDESCU Subject(s):
Study of Surface Microstrains by Electron Speckle-Interferometry Methods Journal title: Український журнал із машинобудування і матеріалознавства Authors: Vadym Zhukovskiy, Olexsandr Gokhman, Marianna Kondrya Subject(s):